Wood inlay card and method for making the same

ABSTRACT

A transaction card construction and a method for making a transaction card are provided for improving card performance. The transaction card construction comprises an inlay component comprising wood and a housing component. The inlay may comprise a wood or wood-containing layer and a backer layer. The backer layer may comprise the same or a different wood or wood-containing layer, or a non-woven fiber material.

CROSS-REFERENCE TO RELATED APPLICATION

The present application is based on and claims the priority ofProvisional Patent Application No. 62/427,634, filed on Nov. 29, 2016,the entire content of which is incorporated herein by reference.

TECHNICAL FIELD

The disclosed embodiments generally relate to transaction cards, andmore particularly, to inlay cards for improving card user satisfactionand card performance.

BACKGROUND

Transaction cards, such as credit and debit cards, have increasinglybecome a primary means for customers to complete financial transactions.Currently transaction cards are typically constructed in a sheetedlaminate press. The shape of the card is die cut and then the card ispersonalized. Typically, transaction cards are cut from laminated sheetsof polyvinyl chloride (PVC) or polycarbonate (PC), or other similarmaterials. After the overall shape of the card is formed, the card maybe modified to add functional and/or visual features. For example, amagnetic strip and/or microchip may be affixed to one side, the card maybe stamped with the card number and customer name, and color or a designmay be added for appearance.

In addition, as transaction cards increase in prevalence, expectationsfor transaction card quality have increased. Transaction cards haveincreasingly been made to meet higher standards regarding materials,durability, and security. Further, traditional card manufacturingmethods, which have employed limited card construction techniques andmaterials, such as PVC, PC, and other similar materials, continue toutilize laminate-based techniques for card construction, thus failing toaddress limitations inherent in such constructions.

The present disclosure is directed to overcoming one or more of theproblems set forth above and/or other problems associated withconventional/traditional transaction cards.

SUMMARY

The disclosed embodiments relate to a transaction card and aprocess/method for constructing the transaction card, wherein thetransaction card includes an inlay comprising a wood material that issecured into a card housing.

Consistent with a disclosed embodiment, a transaction card may include:a housing component having a first housing surface, and a second housingsurface opposite the first housing surface; an inlay component having afirst inlay surface, and a second inlay surface opposite the first inlaysurface, the first inlay surface comprising a wood material; and theinlay and the housing are joined via the second inlay surface and thefirst housing surface.

Consistent with a disclosed embodiment, a transaction card may include:a housing component having a first housing surface, and a second housingsurface opposite the first housing surface; a wood inlay componenthaving a first inlay surface, and a second inlay surface opposite thefirst inlay surface; and the wood inlay component and the housingcomponent are joined via the second inlay surface and the first housingsurface.

Consistent with another disclosed embodiment, a method of manufacturinga transaction card may include: forming a housing component having afirst housing surface and a second housing surface opposite the firsthousing surface; forming an inlay component having a first inlay surfaceand a second inlay surface opposite the first inlay surface, the firstinlay surface having a wood material; and joining the inlay componentand the housing component via the second inlay surface and the firsthousing surface.

Consistent with another disclosed embodiment, a method of manufacturinga transaction card may include: forming a housing component having afirst housing surface and a second housing surface opposite the firsthousing surface; forming a wood inlay component having a first inlaysurface and a second inlay surface opposite the first inlay surface; andjoining the wood inlay component and the housing component via thesecond inlay surface and the first housing surface.

It is to be understood that both the foregoing general description andthe following detailed description are exemplary and explanatory onlyand are not restrictive of the disclosed embodiments, as claimed.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings, which are incorporated in and constitute apart of this specification, illustrate disclosed embodiments and,together with the description, serve to explain the disclosedembodiments. In the drawings:

FIG. 1 is a block diagram of an exemplary transaction system, consistentwith disclosed embodiments;

FIG. 2A is a front view of irst exemplary transaction card, consistentwith disclosed embodiments;

FIG. 2B is a back view of the first exemplary transaction card,consistent with disclosed embodiments;

FIG. 3A is a cross-sectional view of the first exemplary transactioncard in FIG. 2A taken along line 3A-3A, consistent with disclosedembodiments;

FIG. 3B is a cross-sectional view of the first exemplary transactioncard in FIG. 2B taken along line 3B-3B, consistent with disclosedembodiments;

FIG. 3C is a partially disassembled cross-sectional view of the firstexemplary transaction card of FIG. 3B, consistent with disclosedembodiments;

FIG. 4A is a front view of a second exemplary transaction card,consistent with disclosed embodiments;

FIG. 4B is a back view of the second exemplary transaction card,consistent with disclosed embodiments;

FIG. 5A is a cross-sectional view of the second exemplary transactioncard in FIG. 4A taken along line 5A-5A, consistent with disclosedembodiments;

FIG. 5B is a cross-sectional view of the second exemplary transactioncard in FIG. 4B taken along line 5B-5B, consistent with disclosedembodiments;

FIG. 6 is a front view of a third exemplary transaction card, consistentwith disclosed embodiments;

FIG. 7 is a cross-sectional view of the third exemplary transaction cardof FIG. 6, taken along the line 7-7, consistent with disclosedembodiments;

FIG. 8 is a flowchart showing an exemplary method for constructing atransaction card, consistent with the disclosed embodiments;

FIG. 9A is a cross-sectional view of a wood inlay and a plastic cardhousing according to the exemplary method in FIG. 8;

FIG. 9B is a cross-sectional view of a transaction card according to theexemplary method in FIG. 8;

FIG. 10 is a flowchart showing an exemplary method for constructing awood inlay, consistent with the disclosed embodiments

FIG. 11 is a schematic diagram depicting forming a wood-on-wood inlay,according to the exemplary method in FIG. 6A; and

FIG. 12 is a schematic diagram depicting forming a wood-on-fiber inlay,consistent with the disclosed embodiments.

DETAILED DESCRIPTION

Reference will now be made in detail to the disclosed embodiments,examples of which are illustrated in the accompanying drawings. Whereverconvenient, the same reference numbers will be used throughout thedrawings to refer to the same or like parts.

The term “transaction card,” as used herein may refer to a physicalproduct that is configured to provide information, such as financialinformation (e.g., card numbers, account numbers, etc.), quasi-financialinformation (e.g., rewards balance, discount information, etc.) and/orindividual-identifying information (e.g., name, address, etc.), when thecard is read by a card reader. Examples of transaction cards includecredit cards, debit cards, gift cards, rewards cards, frequent flyercards, merchant-specific cards, discount cards, identification cards,membership cards, and driver's licenses, but are not limited thereto.The physical properties of the transaction card (e.g., size,flexibility, location of various components included in the card) maymeet the various international standards, including, e.g., ISO/IEC 7810,ISO/IEC 7811, ISO/IEC 7812, ISO/IEC 7813, ISO/IEC 7816, ISO 8583,ISO/IEC 4909, and ISO/IEC 14443. For example, a transaction card mayhave a dimension of 85.60 mm (width) by 53.98 mm (height) by 0.76 mm(thickness), as specified in ISO/IEC 7810.

Disclosed embodiments include transaction cards and methods formanufacturing a transaction card. For example, disclosed embodimentsinclude transaction card comprising a housing component having a firsthousing surface, and a second housing surface opposite the first housingsurface. The card may further include an inlay component having a firstinlay surface, and a second inlay surface opposite the first inlaysurface, the first inlay surface comprising wood. The inlay componentand the housing component may be joined via the second inlay surface andthe first housing surface.

As used herein, the term “wood” may refer to natural wood (i.e., hardfibrous substance forming the bulk of trees, shrubs, and the likebeneath the bark) and materials containing natural wood (i.e., materialsof which natural wood is an ingredient, constituent, or component).Examples of wood include, but are not limited to, pine wood, walnutwood, cherry wood, mahogany wood, bamboo wood, oak wood, and compositematerials, such as fiberboard (e.g., medium-density fiberboard (MDF)),plywood, and particle board, etc. Different types of wood materials,when used to construct a transaction card, may cause the transactioncard to exhibit different mechanical properties (e.g., flexibility,elasticity, strength, etc.). These differences may be leveraged to allowthe transaction card to meet specifications required for credit cardapplications according to the various international standards mentionedabove, and to achieve a desired wood-like feel or appearance. In someembodiments, a wood surface may be etched or engraved to form variousmarkings thereon, such as, for example, a card holder's name, a cardnumber, and/or other personal or transactional information. In someembodiments, the wood surface may be coated with protective layer, forexample, a stain, or a clear or translucent layer, such as, a lacquer,shellac, polyurethane, acrylic, or other type of non-opaque coating.

In some embodiments, the inlay component may include a first inlay layercomprising wood and a second inlay layer comprising a backer material.For example, in some embodiments, the first inlay layer may comprise afirst wood material, and the backer material may comprise a second woodmaterial. To enhance the mechanical performance of the card (e.g.,rigidity, strength, etc.), the first inlay layer may be rotated withrespect to the second inlay layer such that a wood grain direction ofthe first inlay layer is not parallel with a wood grain direction of thesecond inlay layer. In other embodiments, the backer aterial comprises anon-woven fiber material. For example, the backer material comprisespoly-paraphenylene terephthalamide.

In some embodiments, the inlay component comprises medium-densityfiberboard.

In some embodiments, a wood grain pattern may be formed on the firstinlay surface.

The transaction card may further comprise a data storage componentjoined to the housing. For example, the transaction card may comprise adata storage component disposed between the inlay component and thehousing component.

In addition, disclosed embodiments may include a method of manufacturinga transaction card including the steps of forming a housing componenthaving a first housing surface and a second housing surface opposite thefirst housing surface; forming an inlay component having a first inlaysurface and a second inlay surface opposite the first inlay surface, thefirst inlay surface comprising wood; and joining the inlay component andthe housing component via the second inlay surface and the first housingsurface.

In some embodiments, forming the inlay component may include forming afirst inlay layer comprising wood; forming a second inlay layercomprising a backer material; and joining the first and second inlaylayers. In some embodiments, the first inlay layer may comprise a firstwood material, and the second backer material comprises a second woodmaterial. The method may further include rotating the first inlay layerwith respect to the second inlay layer such that a wood grain directionof the first inlay layer is not parallel with a wood grain direction ofthe second inlay layer. In other embodiments, the backer material maycomprise a non-woven fiber material. For example, the backer materialmay comprise poly-paraphenylene terephthalamide.

In some embodiments, the method may include softening the wood of theinlay component. Softening the wood of the inlay component may preventor reduce the likelihood of damage caused by flexure of the transactioncard.

In some embodiments, the method may include forming a wood grain patternon the first inlay surface.

In some embodiments, the method may include disposing a data storagecomponent on the second housing surface. For example, the method mayfurther include disposing a data storage component between the inlay andthe housing.

FIG. 1 illustrates an exemplary transaction system 10. Transactionsystem 10 may be configured to receive and send information betweencomponents of transaction system 10 and components outside oftransaction system 10. Transaction system 10 may include a financialservice provider system 12 and a merchant system 14 in communicationwith each other through a network 16. Transaction system 10 may includeadditional and/or alternative components.

Financial service provider system 12 may include one or more computersystems associated with an entity that provides financial services. Forexample, the entity may be a bank, credit union, credit card issuer, orother type of financial service entity that generates, provides,manages, and/or maintains financial service accounts for one or morecustomers. Financial service accounts may include, for example, creditcard accounts, checking accounts, savings accounts, loan accounts,reward accounts, and any other types of financial service accounts.Financial service accounts may be associated with physical financialservice transaction cards, such as credit or debit cards that customersuse to perform financial service transactions, such as purchasing goodsand/or services online or at a point of sale (POS) terminal. Financialservice accounts may also be associated with electronic financialproducts and services, such as a digital wallet or similar account thatmay be used to perform electronic transactions, such as purchasing goodsand/or services online.

Merchant system 14 may include one or more computer systems associatedwith a merchant. For example, merchant system 14 may be associated withan entity that provides goods and/or services (e.g., a retail store).The merchant may include brick-and-mortar location(s) that a customermay physically visit to purchase goods and services using thetransaction cards. Such physical locations may include computing devices(e.g., merchant system 14) that perform financial service transactionswith customers (e.g., POS terminal(s), kiosks, etc.). Additionally oralternatively, merchant system 14 may be associated with a merchant whoprovides an electronic shopping environment, such as a website or otheronline platform that consumers may access using a computer through abrowser, a mobile application, or similar software. Merchant system 14may include a client device, such as a laptop computer, desktopcomputer, smart phone, or tablet, which a customer may operate to accessthe electronic shopping mechanism.

Network 16 may include any type of network configured to facilitatecommunications and data exchange between components of transactionsystem 10, such as, for example, financial service provider system 12and merchant system 14. Network 16 may include a Local Area Network(LAN), a Wide Area Network (WAN), such as the Internet. Network 16 maybe a single network or a combination of networks. Network 16 is notlimited to the above examples and transaction system 10 may implementany type of network that allows entities (shown and not shown) oftransaction system 10 to exchange data and information.

Transaction system 10 may be configured to conduct a transaction using atransaction card 20. In some embodiments, financial service providersystem 12 may provide transaction card 20 to a customer for use inconducting transactions associated with a financial service account heldby the customer. For example, the customer may use transaction card 20at a merchant location to make a purchase. During the course of thepurchase, information may be transferred from transaction card 20 tomerchant system 14 (e.g., a point of sale device). Merchant system 14may communicate with financial service provider system 12 via network 16to verify the information and to complete or deny the transaction. Forexample, merchant system 14 may receive account information fromtransaction card 20. Merchant system 14 may transmit the accountinformation and a purchase amount, among other transaction information,to financial service provider system 12. Financial service providersystem 12 may settle the transaction by transferring funds from thecustomer's financial service account to a financial service accountassociated with the merchant.

While transaction system 10 and transaction card 20 are depicted anddescribed in relation to transactions that involve customers, merchants,and financial service providers, it should be understood that theseentities are used only as an example to illustrate one environment inwhich transaction card 20 may be used. Transaction card 20 is notlimited to financial products and may be any physical card product thatis configured to provide information to another device when read by acard reader. For example, transaction card 20 may be an identificationcard configured to provide information to a device in order o identifythe holder of the card (e.g., driver's license).

In some embodiments, transaction card 20 may include a data storagecomponent 24 disposed in a card frame 22. As used herein, a “datastorage component” may be or include one or more devices configured toreceive, store, process, provide, transfer, send, delete, and/orgenerate data or other information. For example, data storage component24 may include a microchip (e.g., EMV chip), a communication device(e.g., Near Field Communication (NFC) antenna, radiofrequencyidentification (RFID) device, Bluetooth® device, WiFi device), amagnetic strip, a barcode, a Quick Response (QR) code, and/or otherdevices. Data storage device 24 may be configured to store informationin a computer-readable format.For example, data storage device may beconfigured to store information in a format that can be read by merchantsystem 14, transmitted over network 16, and read or processed byfinancial service provider system 12 (referring to FIG. 1).

FIGS. 2A and 2B are front and rear views, respectively, of a firstexemplary transaction card 21. FIG. 2A shows a front surface 26 of card21 with a length defined as L_(c), and FIG. 2B shows a rear surface 28of card 21, with a surface 23 of a data storage component exposed (i.e.,a magnetic strip in this exemplary embodiment). The magnetic strip mayhave a length L_(m) which may be less than the card length L_(c), andsurface 23 may be flush with rear side surface 28.

In some embodiments, front surface 26 may include or be provided withvisual details such as a customer name, an account number, dateinformation, a signature associated with the customer (not shown),and/or other information. Such visual details may be generated during aprocess of forming the card (e.g., pressing, laminating, injectionmolding, etc.) or during a process subsequent to card formation (e.g.,milling, laser cutting/etching, stamping, printing, etc.). For example,the signature may be etched into front surface 26 by a fiber laser. Insome embodiments, such visual details may be included on another surface(e.g., rear surface 28) of transaction card 21.

FIG. 3A illustrates a cross-sectional view of an exemplary embodiment ofcard 21 shown in FIG. 2A taken along line 3A-3A. FIG. 3A is a magnifiedview (not to scale) of the card which illustrates surfaces 26 and 28. Asshown, card 21 may include an inlay component 48 having a first (e.g., atop) inlay layer 40 and a second (e.g., a bottom) inlay layer 42(serving as a backer). Card 21 may also include a card housing component44 configured to receive inlay component 48. First inlay layer 40,second inlay layer 42, and housing component 44 may have a thickness ofD₁, D₂, and D₃, respectively. As noted above, the thicknesses of D₁, D₂,and D₃ are magnified for illustrative purpose only and are notnecessarily to scale (nor are the apparent relative sizes of D₁, D₂, andD₃ with respect to each other necessarily to scale). It is noted thatthe values of thicknesses D₁, D₂, and D₃ may vary based on the overalldimensions of card 21, the types of materials employed for makingcomponents of card 21, and/or the processes utilized for manufacturingcomponents of card 21.

First inlay layer 40 and second inlay layer 42 may be formed separatelyand joined to form inlay component 48. First inlay layer 40 may comprisewood. That is, first inlay layer 40 may include a wood material. Forexample, first inlay layer 40 may be formed of a sheet of natural wood.Alternatively, first inlay layer 40 may be formed of a compositematerial that includes or contains wood, such medium-density fibreboard(MDF) or another wood-containing material.

In some embodiments, second inlay layer 42 may also comprise wood. Thatis, second inlay layer 42 may include a wood material. For example,second inlay layer 42 may be formed of a sheet of natural wood.Alternatively, second inlay layer 42 may be formed of a compositematerial that includes or contains a wood material, such as MDF oranother type of wood-containing material.

Second inlay layer 42 may be configured to support first inlay layer 40,for example, to prevent warping, curling, cracking, or other deformationof first inlay layer 40. As mentioned above, different types of wood andwood-containing materials exhibit different mechanical properties thatcan affect how card 21 performs mechanically. When made thin enough tobe used as a component of card 21, wood materials can become flexible,brittle, and prone to warping, curling or breaking. To mitigate theseeffects, second inlay layer 42 may be formed of a wood or non-woodmaterial having mechanical properties configured to compliment themechanical properties of first inlay layer 40. That is, second inlaylayer 42 may be formed of a wood or non-wood material that, when pairedwith the material of first inlay layer 40, causes card 21 to achievedesired overall mechanical properties (i.e., flexibility, strength,etc.). In this way, a desired type of wood material may be selected froma broad range of wood types to form first inlay layer 40 (e.g., toachieve desired visual and/or tactile card properties), and the materialof second inlay layer 42 may be selected and dimensioned to supportfirst inlay layer 42 and ensure that the overall mechanical propertiesof card 21 are sufficient to resist damage and satisfy applicablestandards. Such permissible variation in the use of materials maybroaden the range of material types that can be used to form card 21,since not all wood materials (by themselves or in their natural form)may be able to satisfy the mechanical requirements necessary for use asan inlay layer. That is, instead of forgoing the use of certain types ofwood materials in first inlay layer 40 due to inadequate mechanicalproperties, such wood types may be used in combination with othermaterials of second inlay layer 42 to reduce the likelihood of failuresuch materials, thereby enabling the use of wood materials that may nothave otherwise been suitable.

In some embodiments, desired visual and/or tactile properties of firstinlay layer 40 may be achieved by using a wood material that can bemodified at a surface portion to be imparted with certain wood-likecharacteristics. For example, certain wood materials having desirablevisual and/or tactile properties but are too costly or prone to failuremay be less desirable for use as first inlay layer 40. To achievesimilar visual and/or tactile properties of such wood materials, adifferent material, such as a composite material (e.g., MDF) may bemodified to exhibit the same or similar characteristics.

For example, MDF (or another type of wood or wood material) may bemodified at its surface to resemble a different type of wood. In someembodiments, the wood grain pattern of a desired type of wood may bepressed, etched, carved, or otherwise imparted onto the surface of MDF(or other wood or wood material). The MDF surface having been impartedwith the wood grain design may then be stained or otherwise colored tomatch the natural or stained finish of the desired wood material. Inthis way, the MDF (or other wood or wood material) may be configured tolook like the desired wood material.

At the same time, the MDF (or other wood material) may exhibit tactilequalities similar to the desire type of wood. For example, an MDF (orother wood or wood material) may be chosen that has similar tactileproperties as the desired wood. Post processing techniques, such assanding, sand blasting, etching, chemical treating, or other techniques,may be used to cause the MDF (or other wood or wood material) to moreclosely resemble the tactile properties of the desired wood. In thisway, the range of surface finishes that can be produced on card 21 thatresemble types of natural or modified wood can broadened to includematerials whose natural mechanical properties may be insufficient tomeet the mechanical or standardized requirements of a transaction card.

First and second inlay layers 40 and 42 may be manufactured, forexample, by forming (e.g., die-cutting) a layer of wood orwood-containing material from a piece of material stock, Inlay layers40, 42 may have a thickness ranging from, for example, about 1/24 inchto about 1/16 inch. In this exemplary thickness range, wood andwood-containing materials may exhibit a tendency to curl, ripple, orcrack. To avoid these tendencies during the formation of inlay layers40, 42, the wood or wood-containing material from which first and secondinlay layers 40 and 42 are formed may be softened prior to beingprocessed. For example, a veneer softener that temporarily plasticizeswood particles may be applied prior to processing.

First and second inlay layers 40, 42 may be thinned during subsequentmanufacturing processes to achieve a desired thickness. For example,inlay layers 40, 42 may be sanded, shaved, or otherwise thinned duringformation of inlay component 48. In some embodiments, inlay layers 40,42 may be thinned to achieve a thickness ranging from, for example,about 10 mil to about 30 mil (depending on card performance criteria).It is noted that other thickness ranges may be used depending on, forexample, standardization constraints (e.g., ISO standards), functionallimitations, or other considerations. The desired thickness range ofinlay layers 40 42 may also be selected based on the type of wood orwood-containing materials used. That is, different types wood mayexhibit different mechanical properties at varying thicknesses. Forexample, some wood generally considered to be hard may become brittle orwarp when thinned. Other types of wood generally considered to be softmay exhibit greater durability when thinned.

In some embodiments, inlay layers 40, 42 may be formed of a single typeof wood material. For example, each inlay layer 40, 42 may comprise onetype of wood, such as pine, walnut, bamboo, cherry, or other anothertype of wood or wood-containing material. In other embodiments, inlaylayers 40 and 42 may each comprise a combination of woods and/orwood-containing materials. Combinations of different types of woodsand/or wood-containing materials may be selected to achieve a desirednet mechanical effect of the different materials. For example, stifferor brittle materials may be combined with softer or stronger materialsto improve the overall durability of the combination. For example,combinations of wood types exhibiting different mechanical propertiesmay enhance the ability of the card to resist cracking, warping,permanent deformation, etc., during single- or multi-axis bending.

In some embodiments, inlay layers 40, 42 may be formed of the samematerial. For example, inlay layers 40, 42 may be formed of the sametype of wood or wood-containing material. In other embodiments, inlaylayers 40, 42 may be formed of different materials. That is, inlaylayers 40, 42 may be formed of respectively different types of wood orwood-containing material. For instance, one layer formed of, forexample, pine wood and the other formed of, for example, cherry wood. Itis noted that other combinations including other or different types ofwood and/or wood-containing materials may be used.

In some embodiments, a grain direction and/or pattern of first inlaylayer 40 may be oriented differently with respect to a grain directionand/or pattern of second inlay layer 42. This may be known as“grain-crossing.” For example, the grain direction and/or pattern offirst inlay layer 40 may be rotated with respect to the grain directionand/or pattern of second inlay layer 42. In some embodiments, the graindirection/pattern of first inlay layer 40 may be rotated (or otherwisepositioned or offset) at an angle of 0-360 degrees with respect to thegrain direction/pattern of second inlay layer 42. For example, the graindirections and/or patterns of first and second inlay layers 40, 42 maybe offset by 0-360°, 0-270°, 0-180°, 0-90°, 0-45°, 0-15°, etc. Suchgrain-crossing may provide the wood inlay and/or the card as a wholewith greater rigidity, strength, and overall improved mechanicalproperties along multiple bending axes.

In some embodiments, to prevent the grain-crossing of first and secondinlay layers 40, 42 from being visible, a visual blacker layer may bedisposed between first and second inlay layers 40, 42. That is, inlaylayers 40, 42 may be so thin that the grain pattern of one layer (e.g.,a lower layer) may be visible through the other layer (i.e., a toplayer), which may not present a natural-looking wood material. In suchscenarios, a blocker layer, such as a translucent or opaque material(e.g., a thin film, an adhesive layer, a thin plastic sheet, etc.) or asimilar material with its color matched to the outermost wood veneercolor may be disposed between inlay layers 40, 42.

In some embodiments, the wood or wood material of inlay component 48 maycomprise a layer formed of a medium-density fiberboard (MDF). Forexample, first inlay layer 40 may comprise or be formed of MDF. In otherembodiments, inlay component 48 may comprise only a single inlay layercomprising MDF (as MDF is a relatively stiff and supportive material).In some embodiments, as mentioned above, a wood grain pattern appearancemay be formed onto the layer of MDF (as normal MDF does not have agrain). For example, a wood grain pattern appearance may be die cast,stamped, etched, printed, laser cut, milled, etc., onto the layer of MDFto give the layer a wood grain appearance or finish. In someembodiments, the formed wood grain may be stained or otherwise treatedto accentuate or enhance the wood grain appearance or finish. In otherembodiments, other or different wood-containing materials may be usedinstead of or in addition to MDF.

Inlay layers 40, 42 may be joined to form inlay component 48 using anysuitable method for joining thin layers of material. For example, inlaylayers 40, 42 may be joined by laminating and pressing. In otherembodiments, inlay layers 40, 42 may also or alternatively be joinedusing a thin layer (e.g., one micron thick) of adhesive. That is, anadhesive layer may be used to facilitate laminating and pressing duringthe process of forming wood inlay 48.

In some embodiments, the outer surface of first inlay layer 40 may becoated with protective layer. For example, first inlay layer 40 may becoated with a stain, which may also provide enhanced visual or tactileproperties. A clear or translucent coating may also or alternatively beapplied to first inlay later 40. For example, a lacquer, shellac,urethane, polyurethane, acrylic, or other type of non-opaque coating maybe applied to first inlay layer 40 to provide a protective coating. Thecoating applied to first inlay layer 40 may also act as a sealer toprevent liquid or solid debris from penetrating first inlay layer 40.Additionally, such sealing properties may advantageously enhance theeffects of softening agents used to prevent first inlay layer 40 fromcracking or breaking. That is, sealing first inlay layer 40 aftersoftening with a softening agent may slow the evaporation or wearing ofthe softening agent, thereby prolonging the damage-mitigating effects ofthe softening agent.

In some embodiments, housing 44 may be non-opaque, that is, clear ortranslucent. In such embodiments, card information may be added to aback surface of inlay component 48 and may be visible through housingcomponent 44. The card information may include, but is not limited to,card number, a signature, a customer's name, an expiration date of thecard, a credit card company logo or mark (e.g., VISA, MasterCard, etc.),a hologram, and/or a card issuing company logo, which may be visiblethrough the clear card housing. By locating the card information on theback side of inlay component 48, the card information may be visiblethrough the clear housing 44 (i.e., after card 21 is assembled) and wellprotected from the elements and from tampering. In this way, card 21 maybe more secure, more durable, and its service life may be prolonged.

Housing component 44 may be made of PVC, PC, or other similar materials,and may be manufactured using a molding process, such as aninjection-molding process or a compression-molding process. In someembodiments here housing component 44 is non-opaque, housing component44 may be formed of a clear material or a material that is clear aftermanufacturing is complete (e.g., after setting). For example, housingcomponent 44 may be formed of a resin mixture comprising a thermoplasticelastomer (TPE), which renders plastic housing component 44 translucent.In some embodiments, the TPE may be selected to also provide card 21with a “soft-touch” feel. TPEs may include types of copolymers and/ormixtures of polymers that exhibit properties of thermoplastics andelastomeric materials. For example, the resin mixture may include apolyester elastomer, a block copolymer, a thermoplastic olefin, anelastomeric alloy, a thermoplastic polyurethane, a thermoplasticcopolyester, or a thermoplastic polyimide.

FIG. 3B illustrates a cross-sectional view of the first exemplaryembodiment of card 21 shown in FIG. 2B taken along line 3B-3B of FIG.2B. FIG. 3B is a magnified view of the card construction whichillustrates surfaces 23, 26 and 28, first inlay layer 40, second inlaylayer 42, housing component 44, and a magnetic strip 46. In someembodiments, as shown in FIG. 3B, surface 23 of magnetic strip 46 may beflush with surface 28 of housing component 44.

To further explain the card construction of the first exemplaryembodiment of card 21, FIG. 3C shows a partially disassembledcross-sectional view of card 21 in FIG. 3B. As shown, inlay component 48may include first inlay layer 40 and second inlay layer 42, magneticstrip 46, and housing component 44 with a window 47 cut out. Housingcomponent 44 may have the same thickness D3 as magnetic strip 46 suchthat surface 23 of magnetic strip 46 is configured to be flush withsurface 28 of housing component 44 when housing component 44 and inlaycomponent 48 are assembled, Housing component 44 may be affixed to inlaycomponent 48 by a fastening mechanism, such as an adhesive layer with athickness of, for example, about one micron. For example, inlaycomponent 48 and housing component 44 may be joined as indicated byarrow 43.

FIGS. 4A and 4B are front and rear views, respectively, of a secondexemplary transaction card, referred to as card 60 herein, consistentwith disclosed embodiments. FIG. 4A shows a front surface 66 of an inlaycomponent 67, and a front surface 68 of a housing component 69. Thelength L_(n) of inlay component 67, may be less than the length L_(k) ofhousing component 69.

FIG. 4B shows a rear surface 70 of card 60 with a surface 63 of amagnetic strip 71 exposed. Magnetic strip 71 has a length L_(j) whichmay be less than or equal to the wood inlay length L_(n), and surface 63may be flush with rear side surface 68.

A description of second exemplary transaction card 60 is provided todiscuss configuration characteristics of card construction. Otherdetails and aspects are the same or similar to first exemplary card 21,including materials and processes for manufacturing, and therefore willnot be repeated.

FIG. 5A shows a cross-sectional view of the second exemplary transactioncard 60 shown in FIG. 4A taken along line 5A-5A of FIG. 4A. FIG. 5A is amagnified view showing construction details which illustrate surfaces66, 67 and 68, a first inlay layer 80 of an inlay component 88, a secondinlay layer 82 of inlay component 88, and a housing component 84. Incard 60, housing component 84 encloses inlay component 88circumferentially with front surface 67 flush with front surface 66 ofinlay component 88, whereas in card 21, inlay component 48 is disposeddirectly above housing component 44. Such enclosure of inlay component88 by housing component 84 (e.g., as shown in FIG. 5A) may provide aprotection of inlay component 88 to prevent inlay component 88 frombeing edge damaged or peeling off due to grain stress concentration atperipheral edges of inlay component 88.

FIG. 5B is a cross-sectional view of second exemplary transaction card60 in FIG. 4B taken along line 5B-5B of FIG. 4B, which illustrates asurface 63 of a magnetic strip 86, front surface 66 of inlay component88, front surface 67 of housing component 84, and rear surface 68 ofhousing 84. FIG. 5B further shows magnetic strip 86 coming through awindow cut out of 84. As shown in FIG. 5B, surface 63 of magnetic strip86 is flush with rear surface 68 of housing component 84.

FIG. 6 is a front view of a third exemplary transaction card 90,consistent with disclosed embodiments. As shown in FIG. 6, a microchipor similar data storage component 92 and a front surface 96 of card 90are illustrated. Other than component 92 being housed in an inlaycomponent of card 90, other details and aspects of card 90 are the sameor similar to first exemplary card 21, thus, will not be describedherein.

FIG. 7 is a cross-sectional view of third exemplary transaction card 90in FIG. 6 taken along the line 7-7 of FIG. 6, which shows an inlaycomponent 95 comprising a first inlay layer 98, a second inlay layer 99,and a housing component 97. Further, FIG. 7 illustrates a pocket (orvoid space) 94 cut out of inlay component 95. Pocket 94 may be formedduring the formation of inlay component 95 or during a subsequentmanufacturing process, such as a milling, laser cutting, stamping, orother process. Pocket 94 may be configured to hold or house data storagecomponent 92 and may pass partially or completely through second inlaylayer 99, but does not extend into a magnetic strip (not shown), whichmay be positioned between second inlay layer 99 and housing component97. The dimensions and depths of pocket 94 may be set based on aplurality of criteria such as the size and geometry of a particularmicrochip, industry standards (e.g., ISO standards), manufacturingtolerances, or other considerations.

In some embodiments, a data storage component may be attached to aninner surface of plastic card housing, and a window may be formed in aninlay component to permit access to the data storage component (e.g., toeffectuate data transmission). Further, in some embodiments, a datastroage component (e.g., a magnetic strip) may be attached to an outersurface of a housing component without a window being formed in an inlaycomponent for exposing the data storage component. Additionally in someembodiments, a second data storage component may be housed in thehousing component.

Further, in some embodiments, a window for permitting access to a firstdata storage component may be formed in an inlay component instead of ina housing component. In some embodiments, a pocket for housing a seconddata storage component may be formed in a housing component instead ofin an inlay component. Althernatively, both a window for permittingaccess to a first data storage component and a pocket for housing asecond data storage component may be formed either in a housingcomponent or in an inlay component.

FIG. 8 is a flowchart showing an exemplary method/process 800 forforming a transaction card according to some embodiments of the presentdisclosure. The exemplary method may include forming an inlay componentcomprising wood (Step 802). The inlay component may be a one-layer woodinlay, for example, as shown in FIG. 9A, depicting a cross-sectionalview of a one-layer wood inlay component 902. Inlay component 902 may beformed of, for example, a MDF wood-containing material. Alternatively,inlay component 902 may include a first inlay layer and a second inlaylayer (serving as a backer layer).

At step 804, a housing component is formed for receiving the inlaycomponent. A cross-sectional view of an exemplary housing component 904is shown in FIG. 9A. The housing component may be made of an opaquematerial (e.g., PVC, PC, or other similar materials), a non-opaquematerial (e.g., a translucent or clear TPE material) or a combinationthereof. The housing component may be manufactured using a moldingprocess, such as an injection-molding process or a compression-moldingprocess. Alternatively, the housing may be formed using a laminatingand/or pressing process. It is noted that other processes may be used.

At step 806, the inlay component and the housing component are joined toform a transaction card, as shown in FIG. 9B, depicting across-sectional view of an assembled transaction card 906. The housingcomponent may be affixed to the inlay component by a fasteningmechanism, such as an adhesive layer with a thickness of, for example,one micron. It is noted that other fastening techniques may be used.

As mentioned previously, different wood materials exhibit differentmaterial properties. Some wood materials may exhibit greater resistanceto breaking or cracking (particularly during flexure) after a thinningprocess is performed. Other wood materials may exhibit curling (i.e.warping) when made to be thin enough to use as a wood inlay on the card.Further, when such a wood material is overly thinned, bending itperpendicular to the grain may cause it to snap. Also bi-directionalflexing (twisting) may cause wood material to crack, pop, or break.Therefore, when a wood material is made very thin, it may be providedwith a backing to increase rigidity and reduce flexure. The backing maybe a fiber backing (e.g., non-porous fiber) or wood of the same ordifferent type.

In some embodiments, a “wood-on-wood” inlay may be formed of two woodlayers. FIG. 10 shows an exemplary process 1000 for forming awood-on-wood inlay according to some embodiments of the presentdisclosure. The method may comprise softening first and second woodlayers (Step 1002); thinning the softened wood layers (Step 1004);joining the thinned wood layers to form a laminated layer (Step 1006);and configuring the laminated layer to form the wood inlay (Step 1008).

At step 1002, first and second wood layers are provided. The first andsecond wood layers may be made of the same or different wood materialsand may have a thickness ranging from about 1/24 inch to about 1/16inch. A softening process may be employed by, for example, using aveneer softener, to soften the wood layers. The softening process maytemporarily plasticize the particles of the wood to reduce tendencies ofcracking and breaking during construction of the transaction card.

At step 1004, a thinning process may be employed to reduce the softenedwood layers to a desired thickness. The thinning process may comprise,for example sanding, planning, shaving and/or any other suitablethinning process. The desired thickness for the softened wood veneersmay be the same or different, and may range from about 10 mil to about20 mil, depending on industry or material constraints.

At step 1006, the thinned first and second wood layers may be joined bya fastening mechanism, such as an adhesive layer (which may have athickness of, for example, one micron) or by laminating and/or pressingto form a laminated layer, as shown in FIG. 11. FIG. 11 is a schematicdiagram showing an exemplary wood-on-wood inlay assembly process thatmay be performed at step 1006. In this exemplary embodiment, a firstsoftened and thinned wood layer 50 of a first wood material is laminatedto (as indicated by an arrow 51) a second softened and thinned woodlayer 52 to form a laminated stack (i.e., a wood inlay stack). Again,the first and second wood materials herein may be the same or different,thus providing a flexibility in selecting wood materials for forming awood inlay to meet various card performance and appearance criteria.

In some embodiments, at step 1006, a grain direction of a first woodlayer may be rotated to a certain angular degree (e.g., 90 degrees) withrespect to a grain direction of a second wood veneer layer that acts asa backing layer for the first wood veneer layer. Rotating the woodlayers with respect to each other may increase inlay performance byimproving the stiffness strength, resilience, and overall durability,even under stresses cause by multi-directional bending. In the exemplaryembodiment shown in FIG. 11, a horizontal grain direction (as indicatedby 53) of first wood layer 50 is rotated to 90 degrees with respect to avertical grain direction (as indicated by 54) of second wood layer 52.That is, first wood layer 50 and second wood layer 52 are stacked withtheir grain structure perpendicular to each other. Herein, a horizontalgrain direction indicates that the grain pattern may parallel the lengthof the card, while a vertical grain direction indicates that the grainpattern may parallel the width of the card.

Further, thicknesses of first and second wood layers may vary dependingon, for example, the selected wood materials. For example, greaterflexure along one axis than along another axis (e.g., due to varyingmaterial types or grain structure alignment) may be enhanced orinhibited by making one wood layer thicker than the other. In someembodiments, both first wood layer 50 and second wood layer 52 may havethe same thickness (e.g. 15 mil).

At step 1008 (FIG. 10), the wood inlay component is formed from thelaminated layer (e.g., the wood inlay stack formed in FIG. 11) by, forexample, die-cutting process, milling, or other suitable process. Amilling process may also or alternatively be employed, such as acomputer numerical control (CNC) milling process or other automated,semi-automated, or manual milling process. For example, in thisexemplary method, the laminated layer may be CNC-milled into the desiredwood inlay shape.

In some embodiments, the backing layer (the bottom layer of a woodinlay) may be not a wood material, but may comprise a fabric, such as awoven or non-woven fiber material. In such embodiments, the first woodlayer may have a greater thickness than a corresponding second woodlayer in a wood-on-wood inlay construction. Accordingly, a card havingrelatively more wood material and less non-wood backing material mayprovide some performance benefits, for example, greater strength ordurability, and/or a better feel.

In some embodiments, a method for forming a wood-on-fiber inlay mayinclude providing a wood layer having a thickness of about 1/24 inch toabout 1/16 inch that may to be softened. The wood veneer may then bethinned, for example by sanding down to a desired thickness (e.g., about20 mil), and laminated to a non-woven fiber layer that is configured asa backing layer for the wood veneer layer. The non-woven fiber layer mayhave a thickness of about 10 mil and be joined with the wood veneer witha micron thin layer of adhesive to form a laminated layer. The laminatedlayer may be shaped, for example by CNC milling, into the wood inlayshape.

FIG. 12 is a schematic diagram showing an exemplary wood-on-fiber inlayassembly process that may be performed. In FIG. 12, a softened andthinned wood layer 55 having a grain pattern direction 58 is laminatedto (as indicated by an arrow 57) a non-woven fiber layer 56 to form alaminated stack (i.e., a wood inlay stack). Fiber layer 56 may comprise,for example, poly-paraphenylene terephthalamide. Further, thethicknesses of the wood layer and the fiber layer may vary depending onthe selected wood and fiber materials. Again, a total thickness of awood inlay may comply with performances standards or set industrystandards, such as within 30 mil. In the exemplary embodiment of FIG.12, wood layer 55 has a thickness of 20 mil and non-woven fiber layer 56has a thickness of 10 mil, rendering a wood inlay with a total thicknessof 30 mil.

In some embodiments where an inlay comprising MDF is formed, a method ofmanufacture may include providing a sheet of MDF and forming a thin MDFlayer from the sheet of MDF by, for example, slicing, shaving, etc. Thethin MDF layer may have a thickness ranging from about 10 mil to about30 mil. The method may include forming a grain pattern on the thin MDFlayer by, for example, a die-cutting process, a laser cutting/etchingprocess, or another technique.

In some embodiments, a method may further comprise affixing a datastorage component (e.g., a magnetic strip) to an outer surface of ahousing component. In some embodiments, a method may further compriseaffixing a data storage component (e.g., a magnetic strip) to an innersurface of a housing component. Alternatively, in some embodiments, amethod may further comprise affixing a data storage component (e.g., amagnetic strip) to a bottom surface of a wood inlay.

In some embodiments, a method may further comprise forming a window in awood inlay to permit access to a data storage component disposed withina housing component. In some embodiments, a method may further compriseforming a window in a housing component to expose a data storagecomponent disposed on a bottom surface of a wood inlay. In someembodiments where a housing is a clear housing component, a windowformed in the clear housing component may be only partially cut-throughand have a depth measured from an inner surface (or a top surface)towards an outer surface (or a bottom surface) of the clear cardhousing. The window depth may be less than thickness of the clearhousing component and up to a depth such that a data storage component(e.g., a magnetic strip) disposed on a bottom surface of a wood inlaymay be read by a card reader.

In some embodiments, the window may be formed using a milling process,such as a computer numerical control (CNC) milling process or anotherautomated, semi-automated, or manual milling process. Alternatively, thewindow may be formed as part of an injection molding process formanufacturing a card housing. Further, alternatively, the window may beformed by a grinding process. Additionally, the window may be formed bya laser cutting process or any other suitable process of materialremoval.

In some embodiments, a method may further include forming a pocket in awood inlay for embedding a second data storage component (e.g., amicrochip.) In some embodiments, a method may further include forming apocket in a housing component for embedding a second data storagecomponent (e.g., a microchip.)

While illustrative embodiments have been described herein, the scopeincludes any and all embodiments having equivalent elements,modifications, omissions, combinations (e.g., of aspects across variousembodiments), adaptations or alterations based on the presentdisclosure. For example, the order of the steps of the above exemplarymethod may be rearranged in any preferred or suitable order, or any stepmay be removed or added.

The elements in the claims are to be interpreted broadly based on thelanguage employed in the claims and not limited to examples described inthe present specification or during the prosecution of the application,which examples are to be construed as non-exclusive. It is intended,therefore, that the specification and examples be considered as exampleonly, with a true scope and spirit being indicated by the followingclaims and their full scope of equivalents.

1-19. (canceled)
 20. A method of manufacturing a card, comprising:forming a housing component; forming an inlay component having a firstinlay layer and a second inlay layer, the first inlay layer having athickness of between 1/24 and 1/16 of an inch and comprising a woodmaterial, the second inlay layer being configured to reduce deformationof the first inlay layer; and joining the inlay component and thehousing component via a surface of the second inlay layer and a surfaceof the housing component, such that a surface of the first inlay layeris visible from the exterior of the card.
 21. The method of claim 20,wherein the second inlay layer comprises a wood material, and whereinthe method further comprises: rotating the first inlay layer withrespect to the second inlay layer such that a wood grain direction ofthe first inlay layer is non-parallel with a wood grain direction of thesecond inlay layer.
 22. The method of claim 20, wherein the second inlaylayer comprises a material different from the first inlay layer.
 23. Themethod of claim 22, wherein the second inlay layer comprises a secondwood material.
 24. The method of claim 22, wherein the second inlaylayer comprises a non-woven fiber material.
 25. The method of claim 24,wherein the second inlay layer comprises poly-paraphenyleneterephthalamide.
 26. The method of claim 20, further comprising:disposing a data storage component between the inlay component and thehousing component.
 27. The method of claim 20, wherein the first inlaylayer comprises a natural wood.
 28. The method of claim 20, wherein thefirst inlay layer comprises a composite material.
 29. The method ofclaim 28, wherein the first inlay layer comprises medium-densityfiberboard.
 30. The method of claim 20, wherein the second inlay layercomprises a natural wood.
 31. The method of claim 20, wherein the secondinlay layer comprises a composite material.
 32. The method of claim 31,wherein the second inlay layer comprises medium-density fiberboard. 33.The method of claim 20, further comprising: disposing a visual blockerlayer between the first and second inlay layers.
 34. The method of claim33, wherein the visual blocker layer comprises an opaque material. 35.The method of claim 20, further comprising: coating a surface of thefirst inlay layer with a protective layer.
 36. The method of claim 35,wherein the protective layer comprises at least one of lacquer, shellac,urethane, polyurethane, or acrylic.
 37. The method of claim 20, furthercomprising: adding card information to a second surface of the housingcomponent, the card information is visible through the housingcomponent.
 38. A method of manufacturing a card, comprising: forming ahousing component; forming an inlay component having a first inlay layerand a second inlay layer, the first inlay layer having a thickness ofbetween 1/24 and 1/16 of an inch, the first inlay layer comprising amaterial different from a material of the second inlay layer, the secondinlay layer being configured to reduce deformation of the first inlaylayer; and joining the inlay component and the housing component via asurface of the second inlay layer and a surface of the housingcomponent, such that a surface of the first inlay layer is visible fromthe exterior of the card.
 39. A method of manufacturing a card,comprising: forming a housing component; forming an inlay componenthaving a first inlay layer and a second inlay layer, the first inlaylayer having a thickness of between 1/24 and 1/16 of an inch andcomprising a wood material, the second inlay layer being configured toreduce deformation of the first inlay layer; disposing a visual blockerlayer between the first and second inlay layers; and joining the inlaycomponent and the housing component via a surface of the second inlaylayer and a surface of the housing component.